Theoretical research of cell phone jammer is the basis

Motherboard XY direction ability to locate appropriate; motherboard the BOSS hole and former Shell BOSS gap, 0.1mm copper nut ultrasonic hot-melt or inserts the way embedded within the first shell BOSS motherboard with the boss gap in 0.07mm. Self tapping BOSS. Motherboard front patch avoid as much as possible before the shell BOSS column boss column hidden distribution: M (screw diameter) +0.8 (before shell BOSS wall thickness) * 2 + 0.6 (before shell BOSS strengthen the tendon width) * 2 +0.4 (ribs and Devices gap) * 2 = M (screw diameter) +3.6 mm range of round. The motherboard on the back of the patch to avoid shell BOSS Kong: screw head diameter of 0.15 (conch and after shell hole unilateral gap) * 2 + 0.8 (Backshell BOSS hole wall thickness). The technology is utilized to manufacture  cell phone jammer .
2 +0.6 (after the shell BOSS Kong to strengthen the tendon width) * 2 +0.4 (to strengthen the tendons and Devices gap) * 2 = M (screw head diameter) +3.9 mm, range round. Motherboard the BOSS hole circle 1mm floor of copper, an ESD grounding screw. BB pieces of cloth, the minimum distance plate side of the device PAD 8mil (8 * 0.025 = 0.2mm). No copper on the PCB through-hole four weeks 0.2mm. The key board through-hole to achieve the key PAD to consider this point. (Prohibited in principle on key PAD on the hole, because the sound will affect when the button is pressed). PCB frame dimension tolerance: Edge to edge 0.127; hole location: 0.075; specific to the PCB manufacturer to confirm. Locked in a PCB antenna, buttons, SPK bracket screws. As the technology of  cell phone jammer updates and upgrades.
Reminded not line layout department screw hole below, and the screw holes must be Mark clearly. If hand soldering of the FPC, FPC welding positioning through-hole to increase attention to PCB. Positioning hole distance FPC welding area more than 1mm to prevent the solder block the hole. (See LCD pull welding FPC design). PCB shape and HOUSING inner wall spacing> = 0.5MM, at least to leave 0.3mm. Particular attention to the gap, with the buckle to prevent the buckle without abdication. General and the appearance of at least the distance more than 2.5mm and also pay attention to the side buttons to open cut. Contact with shrapnel devices: SPK, MOTO, antenna, etc., the PCB pads and contact pads X / Y direction must be centered (contact pads must be designed as compression state) and requires unilateral more than 0.5 greater than the contact pads. Theoretical research of cell phone jammer  is the basis.
Ground pad locations: Dome, shell metal parts and LCD must be set aside. Anticipate the positioning holes in the motherboard and the front shell, the location of the DOME attached positioning holes, antenna bracket, bracket keys, SPK bracket positioning holes. a SMT pad line on the PCB to draw (bottom of the device must also draw the pad box). The positioning of the accessories, the location of the broken plate hole draw. Electrostatic protection of the exposed copper areas will need to draw. The regional draw of the forbidden cloth. D0.5 ~ 0.8MM radius of the rounded shape of the corner (the best advice of manufacturers of general-purpose cutter diameter). When the thickness of the PCB version of the painting 3D must take the upper limit: thickness less than 1mm thickness plus 0.1mm; thickness greater than 1mm thickness plus 10%. The technology grade of  cell phone jammers is one of the most important steps.